Purpose of the training
Gaining comprehensive knowledge including theory and practical tips on modification and repair techniques for electronic circuits and printed circuit boards according to IPC-7711 and IPC-7721 standards
Duration
Hours: 32
Training program
- Chapter I – Introduction: commonly used procedures.
- Chapter II – Connecting wires by braiding.
- Chapter III – Disassembly / assembly of through-hole components.
- Chapter IV – Disassembly / assembly of Chip and Melf components.
- Chapter V – Disassembly / assembly of SOT and SOIC components.
- Chapter VI – Disassembly / assembly of J-Lead and QFP components.
- Chapter VII.Repair of printed circuit boards: repair of solder pads, vias and metallization of holes, tracks, installation of jumpers.
- Chapter VII – Laminate repair.
- Chapter IX – Covering layers: identification, removal, repair.
- Theoretical and practical exam,
- Chapter I is mandatory, the rest depending on the client’s needs.
The training is intended for individuals
Directly dealing with the repair of electronics packages made in PTH and SMT technology
Benefits for participants
- They will gain the latest knowledge on applicable international standards for the repair and modification of electronic packages and printed circuit boards made in surface and through-hole technology
- They will receive a textbook with teaching material
- They will receive a personal, international certificate of completion of the IPC-7711/7721 Certified IPC Specialist training
- They will receive a personal MEN certificate
