Purpose of the training
Gaining comprehensive knowledge including theory and practical tips on the assembly process of through-hole elements, surface elements, as well as wires and cables
Duration
Number of hours: depends on the program – modular training
Training program
Module I – theory
- Introduction
- Product classes and admissibility states according to IPC
- Classification of printed circuit boards
- General requirements for safety, equipment, materials, electrostatic discharge
- General requirements for soldered joints
- General requirements for the assembly of through hole and surface elements, wires and cables,
- Process requirements for cleaning electronic packages
- Requirements for covering layers
- Product quality assurance: test methods, use of statistical control process
- Exam
Module II – theoretical and practical classes
- Soldering of wires to various types of terminals
Module III – theoretical and practical classes
- Assembly of components made in surface technology
Module IV – theoretical and practical classes
- Assembly of components made in through-hole technology
Module V – theoretical classes
- Inspection methodologies: requirements for the assembly of through-hole and surface elements as well as wires and cables
The training is intended for individuals
- Directly involved in the assembly or inspection of printed circuit boards made in PTH and SMT technology
- Directly involved in the assembly or control of connections made with the use of wires and cables
Benefits for participants
- Knowledge of the assembly criteria for PCBs made in surface and through-hole technology, as well as wires and cables, taking into account the applicable international standards
- They will receive a textbook with teaching material
- They will receive a personal, international IPC-J-STD-001 Certified IPC Specialist certificate
- Personal MEN certificate
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